上海需要一位 Package Engineer_Sr Development COF

【猎头职位：上海需要一位 Package Engineer_Sr Development COF】联系人：Amy-Dong，邮箱：hr@kthr.com，微信也可查询职位啦！打开手机微信，搜号码“KTHR_COM”或查找微信公众帐号“KT人才”或扫描以上二维码即可添加，欢迎大家关注！

Responsibilities:

[*]Co-design package/modules with layout specialist
[*]Develop custom Chip on Flex package/modules with suppliers
[*]Develop and define assembly processes, troubleshoot and provide initial production ramp and sustaining support on packaging/module launch
[*]Communicate across groups within internal regarding needs in ramping up new technologies (manufacturing processes, materials, testing requirements, sourcing, etc.)     
[*]Provide direction to chip designer during the developmental stage to design an optimum pad layout for most cost effective package
[*]Help assess manufacturability of new module and assembly technologies
[*]Manage logistics, materials and education needed to transfer new technologies into selected manufacturing sites; Work with marketing and chip lead to select packages and Define packaging cost and roadmap for new devices; Lead new packaging and process technology development and the deployment of the technology in HVM
[*]Work closely with QA and customer to resolve quality issues
[*]Interface with packaging vendors to identify quality, production and technology capabilities, technology improvement plans and cost reduction goals
[*]Travel to manufacturing sites to make assessments of their technical capability and report back to company
Required Experience:

[*]Minimum 7 years’ experience in semiconductor package development, layout and characterization. At least 2 years of Chip on Flex experience.
[*]BS or greater, preferably in Physics, Mechanical Engineering, Chemical Engineering, Material Science or a closely related field
[*]Excellent communication, reasoning and problem-solving skills
[*]Experience in manufacturing consumer electronics products
[*]Knowledge of manufacturing process control
[*]Experience with package and module development processes including writing specifications, design, and validation
[*]Solid background with hands on work ethic, team player with experience working across geographically diverse teams.
[*]Ability to work creatively and independently with minimum supervision following  specifications and project schedule.
[*]Experiencewith tools used in package design and circuit, electromagnetic and thermalsimulation and characterization with especially strong authority on CadenceAPD/APE, ACAD for custom substrate and module design

[*]Niceto have these additional experiences:
[*]Background in sensor packaging
[*]Flip chip on laminate or flex substrate, SMT and Chip attach processes
[*]Flex substrate package development
[*]Materials processing including coating and molding
[*]Antenna radiation and ESD characterization and improvement