оƬδȥδӣ

20230327 09:53
Դ뵼ҵ۲

֮ǰ¡2040ľԲԤ⡷Уǽ˲Ϸչľܼܹ͹ƽ̨ڱУܻͷװĸ

漰豸ʱʵѻͭߡΪ͵ʺ͸߿ɿΪҵṩ˼ѵƬϻоƬ䲼ߡ߼оƬУŻջ 14 Χ (RC) ӳӳռıԽԽ󣬾ԲѰܡ

RC ӳٲС׼ߴcellһѡDZ湩硣е㼤ͨоƬıΪ豸磬Ӷ⻥ӵƹʴ䡣ڶѡhybrid bondingжƣܹСӳϲͬ豸

IBM ڽͭ·ͨе˫Ƕ֮ǰҵڼʴ̷ʹڣڳͨܣ赲ԵʵӰ죬ͭѴﵽżޡҪ赲㣬ǵļɿҪɻسʴ̹աּɷı仯˻յľ޴仯ϵ˫Ƕխϵļʴ̷ͬһС

ɺƺͭѺѡϣԤȻ DRAM ߻߼豸ϸʵ֡

ʴڼ֮ƽһ޴սرʹøݺȽԻýϵ͵£֮伯϶air gapsǿȡģTEL߼ԱͼܼRobert Clark˵airյĵ k (k = 1.0)ṹ֧ţ k (3.3) Ͷ (3.9) ͬ

ˣȵоƬ̺͹߹ӦѰ϶Ϊʵļ Ru subtractive Ru Mo ʴ̣Mo etching ֽԣɲ˸ʺʴ̺๤աǶݡ

IBM ǿһɺ϶ɷһü޵ĸ߻߼⡣

ս֮һǣͼͨ CVD Щխļʱ߰ڶIBM Research ĸ߼ʦ Chris Penny ˵ǿʼоһھõ CD 仯ߣline IITC չʾһ㡣

Penny һʹüspacer pull approachĶͨ׹̣˫Ƕе˫ͼԶ׼-ʴ--ʴ (SALELEself-aligned litho-etch-litho-etch) γɶͨ׺͵ײߡǽͼֱתƵϣƿռокܴԣPenny ָ㲻խߣҲڿߡ

Ϊ˾չͭգоƬͨ׵ײݽ (TaN)ͨ׵Ӱ졣IBM/Ŷչʾݺȸߴ 4:1 18 ׼ߺΧ϶



湩磬

ʽһ߸Ա仯漰湩 (BPD)Բ棬Ա㾧ϷĻźšֵԭΪͺźŴвͬ󡣵Դѭ͵·ϴֵĵߣʹܵǨӰ졣źţʦҪ͵ݺС棬һЩǿԵġ߼߼ 12 14 㼶ܶԴѹIR ѹš

Imec BPD ʹϸ nanoTSV200 ׼࣬320 metal-0첢ھϸ񸲸ǿƵԴϡʹ finFET 豸ʵһ㣬ǽճϵ徧ԲϣԲȻʴ̺ TSVͨϱȥmetal-insulator-metal capacitorIR ѹһ͡ƿչ 2nm ڵ֮⣬Ϊ TSV ռñ׼Ԫ

BPD Լٱ׼Ԫstandard cellsеĹ imec ķ⣬ֱ湦ʴ䷽ոӶȲߡ߶ٽԲ ̴10µm սҪӶ룬ҵĴ衪ڶѵоƬ¡ǣһ罨оƬھһɶȣڱԴԴ

ҲܶעĿı仯ϼйءʵϣϼʵֱ硣ϼ漰ͭӺΧʵļϣÿλͭ΢͹ 1,000

ԲԲW2WWafer-to-waferϼϱоƬԲD2Wdie-to-waferϼϸ졣EV Group ϯ Thomas Uhrmann ʾоƬԲĶҪӵö࣬ΪҪоƬĸǵλãԲλá ԲԾԲڽмϵͼ񴫸еĵײоƬϼ 2010 ıͼ񴫸Ϸ򡣳洢ǵһϼϵNANDӦ̡ʵϣлϼϵ NAND 湫˾ͼ񴫸йϼϵľ飬



ϼϵĹؼղ (ECDelectroplating)CMPӻplasma activation׼ϡָ˻𡣾ЩѾ죬磬˫Ƕͭ͵װоƬϣҪЩϼϵа <100 ׵Ķ׼ȡоƬԲϺͷ빤ߵȴﵽˮƽ 0.5 RMS ֲڶȵijɫ CMP ƽԼʵѼϵĵơ

ȻԲڽɵ໥ϣоƬѾڴھܼʹûϼϣ磬ڹ GaN

㿪ʼﵽʹûϼϾܵĵزʱ÷dzȤΪļѰҵķװҪܵö࣬ҵʦDean Freeman ˵Ӣض˾Ѿ˽ GaN ϵĹdzȤ RF ͨ豸еһܺõĻᣬΪڣѾ߼ GaN ٶϡ̼裬һֲϡͨŷĹ̫ȲΧȻʼײĿǰ 5G õˮд

Ƚװ

SoC оƬװϵͳشתȷʵܡĺͳɱָоƬתƵϵͳⲻֻоƬ⣬Freeman˵ζѵЩСоƬԼ跨ɢȵѾװ׶ˣԴƺʼǵ㡣

칹ָڲͬϵļɣѧ߼2.5D΢HBMĹװԼ԰󶨴洢߼ߴ϶RFȵ3D-ICǵͷUMCܲ Steven Hsu ʾͨǿܡ͹Ҫ߳ɱЧ潫ӦôҪ

Amkor߼װͼɸܲ Mike Kellyʾ2.5D 3D ɽչа뵼ӦáȻͳɱӦú͸г֮սͬͳɱӦýҪ²ʵִ

СоƬĹζЩСоƬ֮ĸߴӿڣȽװߴСоƬߴҪźŴٶȣͨҪӿߣKelly ˵߶͹СĸСоƬ͹ʩ൱ѹⷴҪȽ豸ʵdieͻ֮ö׼߾װͬʱָdzҪ ˵Ҫҵ粻ƶ k ϵķչ

˾ͨŹйоƬʱװԲ̵ͬСоƬĶоƬװСоƬܻͨҵӿֵPromex Industries̸ܲ Chip Greely ˵⽫һЩ˾Ȼǽƶij͵ƽ̨㼣ǽͬ.Ȼ˶濴˵'ôȥ' ĸˡȻǿĹ˾ӹܡڴڼ䣬 chiplet 뷨ȻԷdzʵáװоƬǿɵؽоƬͬһ壬 RDL һнӿڣΪװĻԭоƬװװоƬ߼ϡûиı䡣

ǰ˺ͺ֮Ľ޲ǰFEOL BEOL ֮ĴͳڱģΪ 3D װW2W/C2W ԼоƬ以װܶȵijСܵעUMC Hsu ˵ζ FEOL BEOL Щҵչ澺ʵѾչǵķ԰ͳ OSAT ܣرȽIJƷ򡣴ӳԶFEOL BEOL ĸ߶ȼɽʵָϵͳıҪ⽫δҵֲӰ졣

APSTL ϯټʰ뵼·ͼ (IRDS) װɲֵϯ Dev Gupta ˵װƵκμԤⶼӦ÷ӳȥõ֪ʶȽװʹõмУԼ֮ĦӢضʮǰġ Gupta ָ˵ƺ͹㵹װоƬоол壬ӵЩר1995 ꣬ѹֻ GaAs RF ģĻװ1998 ꣬лол 2002 Ͷڷ

Gupta ǿڸܼȽװĿһֱǾҪԼԼ͵еķװʧӦѰµķԾٶȻеӦͿɿԵӰ졣˵

IEDM ϣASE̺ͼӪ߼ܼ Lihong Caoоȳѵװ (FOPoP)FO оƬ FOCoS ŵIJͬϸгڸܶƬӣŽƬʹ 0.8µm L/S ܹƬ֮ͨţرƶװܼ AI/ML Сһ棬ǿ FOPoP Ϊ͸ܶȼɵĹؼƽ̨ijԡӦôƶװߺ͹ͬװĹѧӦáûл˼вʹθ

ȳͷװսģߣmoldwarpagedie shift ɲ֮ϵƥġAmkor ӵж 6 طֲĺϸ FO Kelly ûԤҪ 6 㣬ȷʵԤ RDL ߺͿռ佫ӽ 2µm 0.5 0.8µm ΧȻ΢Ĺ̼Ѿ˼ʮ꣬ҪΪܹķװӦöƵĸ°汾Ĺ豸˵

δ꣬нܻᱻлнȡȽװ㣬ڳɱԣ͸صԭ򣬴 Cu TSV Si н㽫𽥱лнȡʱƣлнСߴ罫 1µm ߺͿռ䣬Kelly ˵

ҵԽԽزøľԲKelly 200 ׾Բĥ SiC Բи豸󡣡ҵĴ󲿷־Բ͹ܶ 200 ׺ 300 ׾Բϡ 200 ׾Բ SiC ֮ǰҪôеװоƬ͹ 150 ׾Բdzѣ˵

ҵ𲽸ĽоƬװɢ֮ʹõȽ (TIM) ĵԣЩϵĵ޵ġ뵼װдԼ 90% ӶݳTIM ǻھۺIJϣй˿ݿӵ絼ʡȻAmkor Kelly ָЩϵ FCBGA ͨ 10W/mK˵ҵʯī TIM TIM ͺȻڷװʹö꣬͸㷺ϸгЩϸгУȹ̫ܹע

ҵԽԽزµĻϡ湩硢ϼϺȽװǽЩյϸи˽⡣þ;֮ǰͭСĽȥͭǶͨ׵ײ TaN ݣµļɷشս¡