PCB设计中专业英译术语之基材的材料

2018年05月07日 14:05    发布者:板儿妹0517
  1. A阶树脂:A-stage resin  2. B阶树脂:B-stage resin  3. C阶树脂:C-stage resin  4. 环氧树脂:epoxy resin  5. 酚醛树脂:phenolic resin  6. 聚酯树脂:polyester resin  7. 聚酰亚胺树脂:polyimide resin  8. 双马来酰亚胺三嗪树脂:bismaleimide-triazine resin  9. 丙烯酸树脂:acrylic resin  10. 三聚氰胺甲醛树脂:melamine formaldehyde resin  11. 多官能环氧树脂:polyfunctional epoxy resin  12. 溴化环氧树脂:brominated epoxy resin  13. 环氧酚醛:epoxy novolac  14. 氟树脂:fluroresin  15. 硅树脂:silicone resin  16. 硅烷:silane  17. 聚合物:polymer  18. 无定形聚合物:amorphous polymer  19. 结晶现象:crystalline polamer  20. 双晶现象:dimorphism  21. 共聚物:copolymer  22. 合成树脂:synthetic  23. 热固性树脂:thermosetting resin  24. 热塑性树脂:thermoplastic resin  25. 感旋光性树脂:photosensitive resin  26. 环氧当量:weight per epoxy equivalent (WPE)  27. 环氧值:epoxy value  28. 双氰胺:dicyandiamide  29. 粘结剂:binder  30. 胶粘剂:adesive  31. 固化剂:curing agent  32. 阻燃剂:flame retardant  33. 遮光剂:opaquer  34. 增塑剂:plasticizers  35. 不饱和聚酯:unsatuiated polyester  36. 聚酯薄膜:polyester  37. 聚酰亚胺薄膜:polyimide film (PI)  38. 聚四氟乙烯:polytetrafluoetylene (PTFE)  39. 聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)  40. 增强材料:reinforcing material  41. 玻璃纤维:glass fiber  42. E玻璃纤维:E-glass fibre  43. D玻璃纤维:D-glass fibre  44. S玻璃纤维:S-glass fibre  45. 玻璃布:glass fabric  46. 非织布:non-woven fabric  47. 玻璃纤维垫:glass mats  48. 纱线:yarn  49. 单丝:filament  50. 绞股:strand  51. 纬纱:weft yarn  52. 经纱:warp yarn  53. 但尼尔:denier  54. 经向:warp-wise  55. 纬向:weft-wise, filling-wise  56. 织物经纬密度:thread count  57. 织物组织:weave structure  58. 平纹组织:plain structure  59. 坏布:grey fabric  60. 稀松织物:woven scrim  61. 弓纬:bow of weave  62. 断经:end missing  63. 缺纬:mis-picks  64. 纬斜:bias  65. 折痕:crease  66. 云织:waviness  67. 鱼眼:fish eye  68. 毛圈长:feather length  69. 厚薄段:mark  70. 裂缝:split  71. 捻度:twist of yarn  72. 浸润剂含量:size content  73. 浸润剂残留量:size residue  74. 处理剂含量:finish level  75. 浸润剂:size  76. 偶联剂:couplint agent  77. 处理织物:finished fabric  78. 聚酰胺纤维:polyarmide fiber  79. 聚酯纤维非织布:non-woven polyester fabric  80. 浸渍绝缘纵纸:impregnating insulation paper  81. 聚芳酰胺纤维纸:aromatic polyamide paper  82. 断裂长:breaking length  83. 吸水高度:height of capillary rise  84. 湿强度保留率:wet strength retention  85. 白度:whitenness  86. 陶瓷:ceramics  87. 导电箔:conductive foil  88. 铜箔:copper foil  89. 电解铜箔:electrodeposited copper foil (ED copper foil)  90. 压延铜箔:rolled copper foil  91. 退火铜箔:annealed copper foil  92. 压延退火铜箔:rolled annealed copper foil (RA copper foil)  93. 薄铜箔:thin copper foil  94. 涂胶铜箔:adhesive coated foil  95. 涂胶脂铜箔:resin coated copper foil (RCC)  96. 复合金属箔:composite metallic material  97. 载体箔:carrier foil  98. 殷瓦:invar  99. 箔(剖面)轮廓:foil profile  100. 光面:shiny side  101. 粗糙面:matte side  102. 处理面:treated side  103. 防锈处理:stain proofing104. 双面处理铜箔:double treated foil以上即是PCB设计中专业英译术语之基材的材料,下期预告:PCB设计中专业英译术语之设计,更多更多行业信息可查阅快点学院订阅号:eqpcb_cp。http://www.eqpcb.com/shop/r/gou/images/img_93.jpg